产品详情

Number of channels 8 Technology family ALS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type Push-Pull Clock frequency (max) (MHz) 75 IOL (max) (mA) 24 IOH (max) (mA) -2.6 Supply current (max) (µA) 29000 Features High speed (tpd 10-50ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family ALS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type Push-Pull Clock frequency (max) (MHz) 75 IOL (max) (mA) 24 IOH (max) (mA) -2.6 Supply current (max) (µA) 29000 Features High speed (tpd 10-50ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Contain Eight Flip-Flops With Single-Rail Outputs
  • Buffered Clock and Direct-Clear Inputs
  • Individual Data Input to Each Flip-Flop
  • Applications Include:
  • Buffer/Storage Registers
  • Shift Registers
  • Pattern Generators
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

 

  • Contain Eight Flip-Flops With Single-Rail Outputs
  • Buffered Clock and Direct-Clear Inputs
  • Individual Data Input to Each Flip-Flop
  • Applications Include:
  • Buffer/Storage Registers
  • Shift Registers
  • Pattern Generators
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

 

These octal positive-edge-triggered flip-flops utilize TTL circuitry to implement D-type flip-flop logic with a direct-clear () input.

Information at the data (D) inputs meeting the setup-time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input signal has no effect at the output.

The SN54ALS273 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS273 is characterized for operation from 0°C to 70°C.

 

 

These octal positive-edge-triggered flip-flops utilize TTL circuitry to implement D-type flip-flop logic with a direct-clear () input.

Information at the data (D) inputs meeting the setup-time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input signal has no effect at the output.

The SN54ALS273 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS273 is characterized for operation from 0°C to 70°C.

 

 

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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 Octal D-Type Flip-Flops With Clear 数据表 (Rev. A) 1994年 12月 1日
* SMD SN54ALS273 SMD 84136012A 2016年 6月 21日
应用手册 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日
应用手册 Advanced Schottky (ALS and AS) Logic Families 1995年 8月 1日

设计和开发

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封装 引脚 CAD 符号、封装和 3D 模型
CDIP (J) 20 Ultra Librarian
CFP (W) 20 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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