产品详情

Package name SOD323 Peak pulse power (8/20 μs) (max) (W) 170 IEC 61000-4-5 (A) 25 Vrwm (V) 3.6 Breakdown voltage (min) (V) 4.5 Bi-/uni-directional Uni-Directional Number of channels 1 IO capacitance (typ) (pF) 4.5 Clamping voltage (V) 6.5
Package name SOD323 Peak pulse power (8/20 μs) (max) (W) 170 IEC 61000-4-5 (A) 25 Vrwm (V) 3.6 Breakdown voltage (min) (V) 4.5 Bi-/uni-directional Uni-Directional Number of channels 1 IO capacitance (typ) (pF) 4.5 Clamping voltage (V) 6.5
SOT (DYF) 2 3.445 mm² 2.65 x 1.3
  • IEC 61000-4-2 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 25-60A (8/20µs)
  • IO capacitance < 20 (typical)
  • Ultra low leakage current: 50nA (maximum)
  • Industrial temperature range: –55°C to +150°C
  • Industry standard SOD-323 leaded package (2.65mm × 1.3mm)
  • IEC 61000-4-2 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 25-60A (8/20µs)
  • IO capacitance < 20 (typical)
  • Ultra low leakage current: 50nA (maximum)
  • Industrial temperature range: –55°C to +150°C
  • Industry standard SOD-323 leaded package (2.65mm × 1.3mm)

The TSDxx are a family of unidirectional TVS protection diodes designed for clamping harmful transients such as ESD and surge. The TSDxx is rated to dissipate ESD strikes up to ±30kV (contact and air gap discharge) and also meets the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

Combining the robust clamping performance and low capacitance of this device, TSDxx is an excellent TVS diode to protect both data and power lines in many different applications.

The TSDxx is offered in the industry standard, leaded SOD-323 package to enable easy solderability.

The TSDxx are a family of unidirectional TVS protection diodes designed for clamping harmful transients such as ESD and surge. The TSDxx is rated to dissipate ESD strikes up to ±30kV (contact and air gap discharge) and also meets the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

Combining the robust clamping performance and low capacitance of this device, TSDxx is an excellent TVS diode to protect both data and power lines in many different applications.

The TSDxx is offered in the industry standard, leaded SOD-323 package to enable easy solderability.

下载 观看带字幕的视频 视频

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 1
类型 标题 下载最新的英语版本 日期
* 数据表 TSDxx Unidirectional TVS Diodes in SOD-323 数据表 (Rev. B) PDF | HTML 2025年 3月 17日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

ESDEVM — ESD 评估模块

静电敏感器件 (ESD) 评估模块 (EVM) 是用于 TI 大部分 ESD 产品系列的开发平台。为了测试任何型号的器件,该电路板支持所有传统的 ESD 封装结构。器件可以焊接到相应封装结构,然后进行测试。如果是典型的高速 ESD 二极管,则应采用阻抗受控布局来获取 S 参数并剥离电路板引线。如果是非高速 ESD 二极管,则应采用有布线连接到测试点的封装结构,以便轻松运行直流测试,例如击穿电压、保持电压、漏电流等。该电路板布局布线还可以通过将信号引脚短接至信号所在的位置,轻松地将任何器件引脚连接到电源 (VCC) 或地。
用户指南: PDF | HTML
从分销商处购买
仿真模型

TSD03 IBIS Model

SLVMEC8.ZIP (1 KB) - IBIS Model
仿真模型

TSD03 PSpice Transient Model

SLVMED2.ZIP (158 KB) - PSpice Model
封装 引脚 CAD 符号、封装和 3D 模型
SOT (DYF) 2 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频