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TIDA-010244

Three-phase shunt-based energy metrology reference design

TIDA-010244

Design files

Overview

This reference design implements Class 0.2S three-phase energy measurement using an isolated high-performance, multichannel analog-to-digital converter (ADC), which samples shunt current sensors at 4kHz to measure the current and voltage of each leg of the AC mains. The reference design achieves high accuracy across a wide input current range (0.05A–100A) and supports higher sampling frequencies necessary for power quality features such as individual harmonic analysis. Faster ADC sampling rates of up to 16ksps can be supported when using a TI Arm® Cortex®-M0+ host microcontroller for calculating the metrology parameters.

Features
  • Three-phase metrology for electricity meters that meets class 0.2S active energy accuracy requirements across 1000:1 input range
  • Support for three-phase four-wire (3P4W) or three-phase three-wire (3P3W) systems with shunts
  • Active and reactive energy and power, root mean square (RMS) current and voltage, power factor, and line-frequency calculations
  • Isolated USB Type-C® with onboard XDS110 debug probe with 5kVRMS isolation, tested across 100mA to 100A input range and 100V to 270V
  • Capable of detecting magnetic tampering using a linear 3D Hall-effect sensor
  • Software for energy metrology with pulsed outputs to a reference test system and displaying results on a Microsoft® Windows® PC GUI
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDUF27.PDF (1263 K)

Reference design overview and verified performance test data

TIDMDT2.PDF (1046 K)

Detailed schematic diagram for design layout and components

TIDMDT3.PDF (350 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDMDT4.PDF (779 K)

Detailed overview of design layout for component placement

TIDMDT5.ZIP (8895 K)

Files used for 3D models or 2D drawings of IC components

TIDCGV3.ZIP (2637 K)

Design file that contains information on physical board layer of design PCB

TIDMDT6.PDF (3123 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Arm Cortex-M0+ MCUs

MSPM0G350780MHz Arm® Cortex®-M0+ MCU with 128KB flash 32KB SRAM 2x4Msps ADC, DAC, 3xCOMP, 2xOPA, CAN-FD, MATHA

Data sheet: PDF | HTML
Clock buffers

LMK1C11044-channel output LVCMOS 1.8-V buffer

Data sheet: PDF | HTML
Isolated ADCs

AMC131M03Three-channel, simultaneous-sampling 24-bit isolated delta-sigma ADC

Data sheet: PDF | HTML
Low-power 2.4-GHz products

CC2340R5SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 512kB flash

Data sheet: PDF | HTML
Matched thin-film resistors

RES60A-Q1Automotive 1400V matched thin-film resistor divider with 12.5MΩ fixed input

Data sheet: PDF | HTML
Multi-axis linear & angle position sensors

TMAG5273Low-power linear 3D Hall-effect sensor with I²C interface

Data sheet: PDF | HTML
Oscillators

CDC6CLow-power, low-jitter, bulk-acoustic-wave (BAW), fixed-frequency LVCMOS oscillator

Data sheet: PDF | HTML

Technical documentation

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Type Title Date
Design guide Three-Phase Shunt-Based Energy Metrology Reference Design PDF | HTML Feb. 04, 2025

Related design resources

Software development

SOFTWARE DEVELOPMENT KIT (SDK)
MSPM0-SDK MSPM0 software development kit (SDK)

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