TIDA-011008

3.6kW, GaN-based single-phase string inverter reference design

TIDA-011008

Design files

Overview

This reference design provides an overview into the implementation of a GaN-based single-phase string inverter. The design consists of one string input, able to handle up to 10 photovoltaic (PV) panels in series. The nominal rated power from string inputs to a single-phase grid connection at 230V is up to 3.6kW. Digital control of the three power stages is executed on a single C2000™ MCU. This board also features a WiFi® communication port to enable easy and remote monitor and control access.

Features
  • Power stage with high power density makes solar inverters lighter and easier to install
  • High switching frequency of 100kHz and high-efficiency design
  • Cost-optimized with MCU GND referenced to VDC-, allows use of nonisolated drive on all GaN devices connected to VDC-
  • Cost-optimized full-bridge topology: Implements an H-bridge bipolar modulation scheme to maintain low control complexity and robust grid injection
  • Excellent power quality: Achieves less than 1.23% current THD with a grid emulator under high load conditions
  • Wireless connectivity: Features the SimpleLink™ dual-band wireless MCU (CC3551E) for integrated Wi-Fi 6 and BLE communication
Output voltage options TIDA-011008.1
Vin (Min) (V) 50
Vin (Max) (V) 500
Vout (Nom) (V) 230
Iout (Max) (A) 16
Output Power (W) 3680
Isolated/Non-Isolated Non-Isolated
Input Type DC
Topology Boost- PFC^Other
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDUFJ9.PDF (2176 KB)

Reference design overview and verified performance test data

TIDME90.PDF (895 KB)

Detailed overview of design layout for component placement

TIDME92.PDF (183 KB)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDME91.ZIP (18206 KB)

Files used for 3D models or 2D drawings of IC components

TIDCGY4.ZIP (1663 KB)

Design file that contains information on physical board layer of design PCB

TIDME89.PDF (4085 KB)

PCB layer plot file used for generating PCB design layout

TIDME88.PDF (1195 KB)

Detailed schematic diagram for design layout and components

Products

Includes TI products in the design and potential alternatives.

Isolated temperature sensors

ISOTMP351.2°C basic isolated temperature sensor with 10mV/°C analog output

Data sheet: PDF | HTML
Wi-Fi products

CC3551ESimpleLink™ wireless MCU with dual-band (2.4GHz and 5GHz) Wi-Fi® 6 and Bluetooth® Low Energy

Data sheet: PDF | HTML
Hall-effect current sensors

TMCS1123±1300V reinforced isolation, 80ARMS 250kHz Hall-effect current sensor with AFR, reference and ALERT

Data sheet: PDF | HTML
Gallium nitride (GaN) power stages

LMG3660R025650V-25mΩ, TOLT Packaged GaN FET with Integrated Gate Driver

Data sheet: PDF | HTML
Real-time digital power MCUs

TMS320F28P551SGC2000™ 32-bit MCU with 160MHz 512KB flash C28x + CLA, five ADCs, CLB, AES and SDFM

Data sheet: PDF | HTML
Analog current-sense amplifiers

INA18526-V, 350-kHz, bi-directional, high-precision current sense amplifier in ultra-small SOT-563 package

Data sheet: PDF | HTML

Technical documentation

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Top documentation Type Title Format options Date
* Design guide 3.6kW, GaN-Based Single-Phase String Inverter Reference Design PDF | HTML Jul 8, 2026
Application note Anti-Islanding Implementation on Single-Phase Grid-Tied Inverter PDF | HTML Jul 15, 2026

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