SN74AUP1G08-Q1

ACTIVE

Product details

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 Inputs per channel 2 IOL (max) (mA) 4 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Automotive Operating temperature range (°C) -40 to 125
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 Inputs per channel 2 IOL (max) (mA) 4 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Automotive Operating temperature range (°C) -40 to 125
SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1
  • AEC-Q100 Qualified with the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C3B
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption:
    ICC = 0.9 µA Max
  • Low Dynamic-Power Consumption:
    Cpd = 4.3 pF Typ at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typ
  • Low Noise: Overshoot and Undershoot
    < 10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better
    Switching Noise Immunity at the Input (Vhys = 250 mV, Typ at
    3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V Input/Output (I/O) Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD-78, Class II

NanoStar is a trademark of Texas Instruments.

  • AEC-Q100 Qualified with the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C3B
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption:
    ICC = 0.9 µA Max
  • Low Dynamic-Power Consumption:
    Cpd = 4.3 pF Typ at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typ
  • Low Noise: Overshoot and Undershoot
    < 10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better
    Switching Noise Immunity at the Input (Vhys = 250 mV, Typ at
    3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V Input/Output (I/O) Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD-78, Class II

NanoStar is a trademark of Texas Instruments.

The AUP family is TI’s premier solution to the low-power needs of the industry in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

This single 2-input positive-AND gate performs the Boolean function: Y = A • B or Y = A\ + B\ in positive logic.

NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it uses the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI’s premier solution to the low-power needs of the industry in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

This single 2-input positive-AND gate performs the Boolean function: Y = A • B or Y = A\ + B\ in positive logic.

NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it uses the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

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Type Title Date
* Data sheet LOW-POWER SINGLE 2-INPUT POSITIVE AND GATE datasheet 12 Dec 2012
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
More literature Automotive Logic Devices Brochure 27 Aug 2014
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Simulation model

SN74AUP1G08 Behavioral SPICE Model

SCEM690.ZIP (7 KB) - PSpice Model
Simulation model

SN74AUP1G08 IBIS Model (Rev. A)

SCEM405A.ZIP (65 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
SOT-SC70 (DCK) 5 Ultra Librarian

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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