TIDA-01531

Low-Power Wireless M-Bus Communications Module Reference Design

TIDA-01531

Design files

Overview

This reference design explains how to use the TI wireless M-Bus stack for CC1310 and CC1350 wireless MCUs and integrate it into a smart meter or data-collector product. This software stack is compatible with the Open Metering System (OMS) v3.0.1 specification. EN13757-1 through EN13757-7 are European standards for meter reading and include both wired and wireless metering-bus (M-Bus); these together are very popular in ultra-low-power metering and sub-metering applications. This design offers ready-to-use binary images for any of the wireless M-Bus S-, T-, or C-modes at 868 MHz with unidirectional (meter) or bidirectional configurations (both meter and data collector). Multiple precompiled binary images are provided that cover metering applications, including but not limited to heat cost allocators (HCAs), gas, water, and heat meters, or e-meters with an external host MCU.

Features
  • Meets EN13757-4 class HR requirements for sensitivity and selectivity and class HT for transmit power in S-, T-, and C-modes
  • Complete single-chip implementation with serial interface to host MCU
  • Consumes only 0.7 µA @ 3.6 V in shutdown mode
  • Embedded (API level) interface for combining wM-Bus stack and meter application
  • wM-Bus OMSv3.0.1-compliant S- and T- modes (S1, S2, T1, T2) with C1 and C2 modes added
  • Supports meter and data collector (also called "Other") functionality
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Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUDG0.PDF (7932 KB)

Reference design overview and verified performance test data

TIDRST4.PDF (53 KB)

Detailed overview of design layout for component placement

TIDRST3.PDF (51 KB)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRST6.ZIP (3366 KB)

Files used for 3D models or 2D drawings of IC components

TIDCDV1.ZIP (300 KB)

Design file that contains information on physical board layer of design PCB

TIDRST5.PDF (1083 KB)

PCB layer plot file used for generating PCB design layout

TIDRST2.PDF (130 KB)

Detailed schematic diagram for design layout and components

Products

Includes TI products in the design and potential alternatives.

Sub-1 GHz wireless MCUs

CC1350SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML
Sub-1 GHz wireless MCUs

CC1310SimpleLink™ 32-bit Arm Cortex-M3 Sub-1 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML

Start development

Hardware development

Evaluation board

LAUNCHXL-CC1310 — SimpleLink™ Sub-1 GHz wireless microcontroller (MCU) LaunchPad™ development kit

This reference design explains how to use the TI wireless M-Bus stack for CC1310 and CC1350 wireless MCUs and integrate it into a smart meter or data-collector product. This software stack is compatible with the Open Metering System (OMS) v3.0.1 specification. EN13757-1 through EN13757-7 are (...)
Supported products & hardware

Supported products & hardware

Hardware development
Reference design
TIDA-00816 Grid IoT Reference Design: Connecting Fault Indicators, Data Collector, Mini-RTU Using Sub-1GHz RF TIDA-010003 Simple 6LoWPAN mesh end-node improves network performance reference design TIDA-01066 Low-Power Door and Window Sensor With Sub-1GHz and 10-Year Coin Cell Battery Life Reference Design TIDA-01236 Reference Design to Extend Coin Cell Battery Run Time in Wireless Ultrasonic Gas Leak Detector TIDA-01518 Low-Power Flood/Freeze Detector Reference Design With Sub-1 GHz and 10-Year Coin Cell Battery Life TIDA-01531 Low-Power Wireless M-Bus Communications Module Reference Design TIDC-01002 SimpleLink™ Sub-1 GHz Sensor to Cloud Gateway Reference Design for TI-RTOS Systems TIDC-01004 Dual-Band RF Spectrum Analyzer Reference Design TIDEP0084 Sub-1 GHz Sensor to Cloud Industrial IoT Gateway Reference Design for Linux Systems
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LAUNCHXL-CC1310 SimpleLink™ Sub-1 GHz wireless microcontroller (MCU) LaunchPad™ development kit

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Hardware development
Reference design
TIDA-00816 Grid IoT Reference Design: Connecting Fault Indicators, Data Collector, Mini-RTU Using Sub-1GHz RF TIDA-010003 Simple 6LoWPAN mesh end-node improves network performance reference design TIDA-01066 Low-Power Door and Window Sensor With Sub-1GHz and 10-Year Coin Cell Battery Life Reference Design TIDA-01236 Reference Design to Extend Coin Cell Battery Run Time in Wireless Ultrasonic Gas Leak Detector TIDA-01518 Low-Power Flood/Freeze Detector Reference Design With Sub-1 GHz and 10-Year Coin Cell Battery Life TIDA-01531 Low-Power Wireless M-Bus Communications Module Reference Design TIDC-01002 SimpleLink™ Sub-1 GHz Sensor to Cloud Gateway Reference Design for TI-RTOS Systems TIDC-01004 Dual-Band RF Spectrum Analyzer Reference Design TIDEP0084 Sub-1 GHz Sensor to Cloud Industrial IoT Gateway Reference Design for Linux Systems
Development kit

LAUNCHXL-CC1350US — CC1350 LaunchPad™ development kit for SimpleLink™ dual-band wireless MCU

This reference design explains how to use the TI wireless M-Bus stack for CC1310 and CC1350 wireless MCUs and integrate it into a smart meter or data-collector product. This software stack is compatible with the Open Metering System (OMS) v3.0.1 specification. EN13757-1 through EN13757-7 are (...)
Supported products & hardware

Supported products & hardware

Hardware development
Reference design
TIDA-01469 Motor Monitoring Using Wireless Vibration Sensor Reference Design Enabling Preventive Maintenance TIDA-01531 Low-Power Wireless M-Bus Communications Module Reference Design TIDC-01001 Commissioning Sensors in a Sub-1 GHz Network Over Bluetooth® low energy Reference Design TIDC-01002 SimpleLink™ Sub-1 GHz Sensor to Cloud Gateway Reference Design for TI-RTOS Systems TIDC-01004 Dual-Band RF Spectrum Analyzer Reference Design TIDEP0084 Sub-1 GHz Sensor to Cloud Industrial IoT Gateway Reference Design for Linux Systems
In stock
Limit:
Out of stock on TI.com
Not available on TI.com

LAUNCHXL-CC1350US CC1350 LaunchPad™ development kit for SimpleLink™ dual-band wireless MCU

close
Latest version
Version: null
Release date:
Hardware development
Reference design
TIDA-01469 Motor Monitoring Using Wireless Vibration Sensor Reference Design Enabling Preventive Maintenance TIDA-01531 Low-Power Wireless M-Bus Communications Module Reference Design TIDC-01001 Commissioning Sensors in a Sub-1 GHz Network Over Bluetooth® low energy Reference Design TIDC-01002 SimpleLink™ Sub-1 GHz Sensor to Cloud Gateway Reference Design for TI-RTOS Systems TIDC-01004 Dual-Band RF Spectrum Analyzer Reference Design TIDEP0084 Sub-1 GHz Sensor to Cloud Industrial IoT Gateway Reference Design for Linux Systems

Software development

Support software

TIDCDV2 — TI Wireless M-Bus Stack

Supported products & hardware

Supported products & hardware

Hardware development
Reference design
TIDA-01531 Low-Power Wireless M-Bus Communications Module Reference Design
Download options

TIDCDV2 TI Wireless M-Bus Stack

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Latest version
Version: 01.00.00.00
Release date: Sep 21, 2017
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Hardware development
Reference design
TIDA-01531 Low-Power Wireless M-Bus Communications Module Reference Design

Release Information

The design resource accessed as www.ti.com/lit/zip/tidcdv2 or www.ti.com/lit/xx/tidcdv2/tidcdv2.zip has been migrated to a new user experience at www.ti.com/tool/download/TIDCDV2. Please update any bookmarks accordingly.

Technical documentation

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Top documentation Type Title Format options Date
* Design guide Low-Power wM-Bus Communications Module Reference Design Sep 22, 2017
Application brief Low-power wM-Bus Stack Implementation With CC1310 and CC1350 PDF | HTML Oct 19, 2018
Application note Using the MSP430FR6047 Wireless M-Bus Serial Library for Metering Applications Apr 5, 2018

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