DRV8814
- 8 V to 45 V Operating Supply Voltage Range
- 2.5 A Maximum Drive Current at 24 V and TA = 25°C
- Dual H-Bridge Current-Control Motor Driver
- Drives Two DC Motors
- Four Level Winding Current Control
- Multiple Decay Modes
- Slow Decay
- Fast Decay
- Industry Standard Parallel Digital Control Interface
- Low Current Sleep Mode
- Built-In 3.3-V Reference Output
- Small Package and Footprint
- Protection Features
- Overcurrent Protection (OCP)
- Thermal Shutdown (TSD)
- VM Undervoltage Lockout (UVLO)
- Fault Condition Indication Pin (nFAULT)
The DRV8814 provides an integrated motor driver solution for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers, and is intended to drive DC motors. The output driver block for each consists of N-channel power MOSFET’s configured as H-bridges to drive the motor windings. The DRV8814 can supply up to 2.5-A peak or 1.75-A RMS output current (with proper heatsinking at 24 V and 25°C) per H-bridge.
A simple parallel digital control interface is compatible with industry-standard devices. Decay mode is programmable to allow braking or coasting of the motor when disabled.
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage lockout, and over temperature.
The DRV8814 is available in a 28-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).
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Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | DRV8814 DC Motor Driver IC datasheet (Rev. E) | PDF | HTML | 30 Nov 2015 |
Application note | Understanding Motor Driver Current Ratings (Rev. A) | PDF | HTML | 05 Jul 2024 | |
Application note | Best Practices for Board Layout of Motor Drivers (Rev. B) | PDF | HTML | 14 Oct 2021 | |
Application note | Calculating Power Dissipation for a H-Bridge or Half Bridge Driver (Rev. A) | PDF | HTML | 22 Jul 2021 | |
Application note | Methods to Configure Current Regulation for Brushed and Stepper Motors (Rev. B) | PDF | HTML | 19 Jan 2021 | |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 06 Jul 2018 | ||
User guide | DRV88xx EVM GUI (Rev. C) | 27 Apr 2017 | ||
Application brief | PowerPAD™ Made Easy (Rev. B) | 12 May 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
HTSSOP (PWP) | 28 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
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