TLV2432
- Output Swing Includes Both Supply Rails
- Extended Common-Mode Input Voltage Range...0 V to 4.5 V (Min) with 5-V Single Supply
- No Phase Inversion
- Low Noise...18 nV/Hz\ Typ at f = 1 kHz
- Low Input Offset Voltage
950 uV Max at TA = 25°C (TLV243xA) - Low Input Bias Current...1 pA Typ
- Very Low Supply Current...125 uA Per Channel Max
- 600- Output Drive
- Macromodel Included
- Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
Advanced LinCMOS is a trademark of Texas Instruments.
The TLV243x and TLV243xA are low-voltage operational amplifier from Texas Instruments. The common-mode input voltage range for each device is extended over the typical CMOS amplifiers making them suitable for a wide range of applications. In addition, these devices do not phase invert when the common-mode input is driven to the supply rails. This satisfies most design requirements without paying a premium for rail-to-rail input performance. They also exhibit rail-to-rail output performance for increased dynamic range in single- or split-supply applications. This family is fully characterized at 3-V and 5-V supplies and is optimized for low-voltage operation. The TLV243x only requires 100 uA (typ) of supply current per channel, making it ideal for battery-powered applications. The TLV243x also has increased output drive over previous rail-to-rail operational amplifiers and can drive 600- loads for telecom applications.
The other members in the TLV243x family are the high-power, TLV244x, and micro-power, TLV2422, versions.
The TLV243x, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels and low-voltage operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). For precision applications, the TLV243xA is available and has a maximum input offset voltage of 950 uV.
If the design requires single operational amplifiers, see the TI TLV2211/21/31. This is a family of rail-to-rail output operational amplifiers in the SOT-23 package. Their small size and low power consumption, make them ideal for high density, battery-powered equipment.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Advanced LinCMOS Rail-to-Rail Output Wide-Input-Voltage Operational Amplifiers 数据表 (Rev. F) | 2001年 3月 28日 | |||
电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 | |||
应用手册 | TLV2432 and TLV2434 EMI Immunity Performance | 2013年 12月 30日 | ||||
应用手册 | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999年 12月 22日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:
- D(SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 和 SOT23-6)
- DCK(SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 适配器评估模块
借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试,该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器,或者将这些端子板直接连接至现有电路。
DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:
- D 和 U (SOIC-8)
- PW (TSSOP-8)
- DGK(MSOP-8、VSSOP-8)
- DBV(SOT23-6、SOT23-5 和 SOT23-3)
- DCK(SC70-6 和 SC70-5)
- DRL (SOT563-6)
DUAL-DIYAMP-EVM — 双通道通用自制 (DIY) 放大器电路评估模块
DUAL-DIYAMP-EVM 系列可实现快速、方便的原型设计,并且使用常用的 0805 或 0603 (...)
ANALOG-ENGINEER-CALC — 模拟工程师计算器
CIRCUIT060013 — 采用 T 网络反馈电路的反相放大器
CIRCUIT060074 — 采用比较器的高侧电流检测电路
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模拟仿真程序
TINA-TI 安装需要大约 500MB。直接安装,如果想卸载也很容易。我们相信您肯定会爱不释手。
TINA 是德州仪器 (TI) 专有的 DesignSoft 产品。该免费版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需获取可用 TINA-TI 模型的完整列表,请参阅:SpiceRack - 完整列表
需要 HSpice (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点