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CSD16321Q5
- Optimized for 5V gate drive
- Ultra-low Qg and Qgd
- Low-thermal resistance
- Avalanche rated
- Lead-free terminal plating
- RoHS compliant
- SON 5mm × 6mm plastic package
This 25V, 1.9mΩ, 5mm × 6mm SON NexFET™ power MOSFET has been designed to minimize losses in power conversion and optimized for 5V gate drive applications.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | CSD16321Q5 25V N-Channel NexFET™ Power MOSFET datasheet (Rev. E) | PDF | HTML | 01 Dec 2023 |
Application note | Avoid Common Mistakes When Selecting And Designing With Power MOSFETs | PDF | HTML | 06 Nov 2024 | |
Application note | MOSFET Support and Training Tools (Rev. F) | PDF | HTML | 14 Jun 2024 | |
Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 25 Mar 2024 | |
Application note | Using MOSFET Transient Thermal Impedance Curves In Your Design | PDF | HTML | 18 Dec 2023 | |
Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 06 Dec 2023 | |
Application note | Using MOSFET Safe Operating Area Curves in Your Design | PDF | HTML | 13 Mar 2023 | |
Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | 31 May 2022 | |
Selection guide | Power Management Guide 2018 (Rev. R) | 25 Jun 2018 | ||
Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | 16 Nov 2011 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
TPS40304EVM-353 — 8-14V Vin, 1.2V Vout Sync Buck Controller Evaluation Module with NexFET™ Power MOSFETs
The TPS40304EVM-353 evaluation module is a synchronous buck controller providing a 1.2-V output at up to 20 A from a nominal 12-V input bus. The EVM is designed to start-up from a single supply, and no additional bias voltage is required. The module uses our NexFET™ high performance MOSFETs (...)
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Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
VSON-CLIP (DQH) | 8 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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