CSD87330Q3D
30-V, N channel synchronous buck NexFET™ power MOSFET, SON 3 mm x 3 mm power block, 20 A
CSD87330Q3D
- Half-Bridge Power Block
- Up to 27-V VIN
- 90% System Efficiency at 15 A
- Up to 20-A Operation
- High-Frequency Operation (Up to 1.5 MHz)
- High-Density SON 3.3-mm × 3.3-mm Footprint
- Optimized for 5-V Gate Drive
- Low-Switching Losses
- Ultra-Low Inductance Package
- RoHS Compliant
- Halogen Free
- Lead-Free Terminal Plating
The CSD87330Q3D NexFET™ power block is an optimized design for synchronous buck applications offering high-current, high-efficiency, and high-frequency capability in a small 3.3-mm × 3.3-mm outline. Optimized for 5-V gate drive applications, this product offers a flexible solution capable of offering a high-density power supply when paired with any 5-V gate drive from an external controller/driver.
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Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | CSD87330Q3D Synchronous Buck NexFET™ Power Block datasheet (Rev. D) | PDF | HTML | 06 Dec 2016 |
Application note | Avoid Common Mistakes When Selecting And Designing With Power MOSFETs | PDF | HTML | 06 Nov 2024 | |
Application note | MOSFET Support and Training Tools (Rev. F) | PDF | HTML | 14 Jun 2024 | |
Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 25 Mar 2024 | |
Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 06 Dec 2023 | |
Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | 31 May 2022 | |
Selection guide | Power Management Guide 2018 (Rev. R) | 25 Jun 2018 | ||
Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | 16 Nov 2011 | ||
Application note | PowerStack™ Packaging Technology Overview | 18 Jul 2011 |
Design & development
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Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
VSON-CLIP (DPB) | 8 | Ultra Librarian |
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