TLC2262
- Output Swing includes Both Supply Rails
- Low Noise...12 nV/Hz\ Typ at f = 1 kHz
- Low Input Bias Current...1 pA Typ
- Fully Specified for Both Single-Supply and Split-Supply Operation
- Low Power...500 uA Max
- Common-Mode Input Voltage Range Includes Negative Rail
- Low Input Offset Voltage
- 950 uV Max at TA = 25°C (TLC2262A)
- Macromodel Included
- Performance Upgrade for the TS27M2/M4 and TLC27M2/M4
- Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control/Print Support
Qualification to Automotive Standards
Advanced LinCMOS is a trademark of Texas Instruments.
The TLC2262 and TLC2264 are dual and quadruple operational amplifiers from Texas Instruments. Both devices exhibit rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLC226x family offers a compromise between the micropower TLC225x and the ac performance of the TLC227x. It has low supply current for battery-powered applications, while still having adequate ac performance for applications that demand it. The noise performance has been dramatically improved over previous generations of CMOS amplifiers. Figure 1 depicts the low level of noise voltage for this CMOS amplifier, which has only 200 uA (typ) of supply current per amplifier.
The TLC226x, exhibiting high input impedance and low noise, are excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). For precision applications, the TLC226xA family is available and has a maximum input offset voltage of 950 uV. This family is fully characterized at 5 V and ±5 V.
The TLC2262/4 also makes great upgrades to the TLC27M2/L4 or TS27M2/L4 in standard designs. They offer increased output dynamic range, lower noise voltage and lower input offset voltage. This enhanced feature set allows them to be used in a wider range of applications. For applications that require higher output drive and wider input voltage range, see the TLV2432 and TLV2442. If your design requires single amplifiers, please see the TLV2211/21/31 family. These devices are single rail-to-rail operational amplifiers in the SOT-23 package. Their small size and low power consumption, make them ideal for high density, battery-powered equipment.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Advanced LinCMOS Rail-to-Rail Op Amps 数据表 (Rev. D) | 2001年 3月 16日 | |||
电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 | |||
应用手册 | TLC2262 and TLC2264 EMI Immunity Performance | 2013年 8月 19日 | ||||
应用手册 | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999年 12月 22日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:
- D(SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 和 SOT23-6)
- DCK(SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 适配器评估模块
借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试,该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器,或者将这些端子板直接连接至现有电路。
DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:
- D 和 U (SOIC-8)
- PW (TSSOP-8)
- DGK(MSOP-8、VSSOP-8)
- DBV(SOT23-6、SOT23-5 和 SOT23-3)
- DCK(SC70-6 和 SC70-5)
- DRL (SOT563-6)
DUAL-DIYAMP-EVM — 双通道通用自制 (DIY) 放大器电路评估模块
DUAL-DIYAMP-EVM 系列可实现快速、方便的原型设计,并且使用常用的 0805 或 0603 (...)
ANALOG-ENGINEER-CALC — 模拟工程师计算器
CIRCUIT060013 — 采用 T 网络反馈电路的反相放大器
CIRCUIT060074 — 采用比较器的高侧电流检测电路
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模拟仿真程序
TINA-TI 安装需要大约 500MB。直接安装,如果想卸载也很容易。我们相信您肯定会爱不释手。
TINA 是德州仪器 (TI) 专有的 DesignSoft 产品。该免费版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需获取可用 TINA-TI 模型的完整列表,请参阅:SpiceRack - 完整列表
需要 HSpice (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
TSSOP (PW) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点