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LMG3410R050

ACTIVE

600-V 50-mΩ GaN with integrated driver and protection

Product details

VDS (max) (V) 600 RDS(on) (mΩ) 50 ID (max) (A) 12 Features Bottom-side cooled, Latched overcurrent protection, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 150
VDS (max) (V) 600 RDS(on) (mΩ) 50 ID (max) (A) 12 Features Bottom-side cooled, Latched overcurrent protection, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 150
VQFN (RWH) 32 64 mm² (8 mm × 8 mm)
  • TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles
  • Enables high density power conversion designs
    • Superior system performance over cascode or stand-alone GaN FETs
    • Low inductance 8 mm x 8 mm QFN package for ease of design, and layout
    • Adjustable drive strength for switching performance and EMI control
    • Digital fault status output signal
    • Only +12 V unregulated supply needed
  • Integrated gate driver
    • Zero common source inductance
    • 20 ns Propagation delay for MHz operation
    • Trimmed gate bias voltage to compensate for threshold variations ensures reliable switching
    • 25 to 100V/ns User adjustable slew rate
  • Robust protection
    • Requires no external protection components
    • Overcurrent protection with less than 100 ns response
    • Greater than 150 V/ns Slew rate immunity
    • Transient overvoltage immunity
    • Overtemperature protection
    • Under voltage lock out (UVLO) Protection on all supply rails
  • Robust protection
    • LMG3410R050: Latched overcurrent protection
    • LMG3411R050: Cycle-by-cycle overcurrent protection
    • TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles
    • Enables high density power conversion designs
      • Superior system performance over cascode or stand-alone GaN FETs
      • Low inductance 8 mm x 8 mm QFN package for ease of design, and layout
      • Adjustable drive strength for switching performance and EMI control
      • Digital fault status output signal
      • Only +12 V unregulated supply needed
    • Integrated gate driver
      • Zero common source inductance
      • 20 ns Propagation delay for MHz operation
      • Trimmed gate bias voltage to compensate for threshold variations ensures reliable switching
      • 25 to 100V/ns User adjustable slew rate
    • Robust protection
      • Requires no external protection components
      • Overcurrent protection with less than 100 ns response
      • Greater than 150 V/ns Slew rate immunity
      • Transient overvoltage immunity
      • Overtemperature protection
      • Under voltage lock out (UVLO) Protection on all supply rails
    • Robust protection
      • LMG3410R050: Latched overcurrent protection
      • LMG3411R050: Cycle-by-cycle overcurrent protection

      The LMG341xR050 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.

      The LMG341xR050 provides a smart alternative to traditional cascode GaN and standalone GaN FETs by integrating a unique set of features to simplify design, maximize reliability and optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with near zero Vds ringing, less than 100 ns current limiting response self-protects against unintended shoot-through events, overtemperature shutdown prevents thermal runaway, and system interface signals provide self-monitoring capability.

      The LMG341xR050 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.

      The LMG341xR050 provides a smart alternative to traditional cascode GaN and standalone GaN FETs by integrating a unique set of features to simplify design, maximize reliability and optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with near zero Vds ringing, less than 100 ns current limiting response self-protects against unintended shoot-through events, overtemperature shutdown prevents thermal runaway, and system interface signals provide self-monitoring capability.

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      Technical documentation

      Design & development

      For additional terms or required resources, click any title below to view the detail page where available.

      Evaluation board

      LMG34XX-BB-EVM — LMG34xx GaN system-level evaluation motherboard for LMG341x Family

      The LMG34XX-BB-EVM is an easy to use breakout board to configure any LMG341x half bridge board, such as the LMG3410-HB-EVM, as a synchronous buck converter. By providing a power stage, bias power and logic circuitry this EVM allows for quick measurements of the GaN device switching. This EVM is (...)

      User guide: PDF
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      Daughter card

      LMG3410EVM-018 — LMG3410R050 600-V 50-mΩ GaN half-bridge daughter card

      LMG3410EVM-018 configures two LMG3410R050 600-V GaN FETs with Integrated driver and protection, in a half bridge. This EVM comes with all the necessary auxiliary peripheral circuitry, and is designed to work in conjunction with larger systems.
      User guide: PDF
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      Simulation model

      LMG3410R050 Unencrypted PSpice Model (Rev. A)

      SNOM689A.ZIP (44 KB) - PSpice model
      Supported products & hardware
      Simulation model

      LMG3410R150 Unencrypted PSPICE Trans Model Package (Rev. A)

      SNOM676A.ZIP (42 KB) - PSpice model
      Supported products & hardware
      Calculation tool

      LMGXX-GAN-LLC-CALC — GaN LLC resonant converter device loss calculator

      Device Loss Calculator can be used to evaluate different devices for different topologies of the LLC Resonant Converter
      Supported products & hardware
      Calculation tool

      SNOR029 — GaN CCM Boost PFC Power Loss Calculation Excel Sheet

      Supported products & hardware
      Calculation tool

      SNOR030 — GaN CCM Totem Pole PFC Power Loss Calculation Excel Sheet

      Supported products & hardware
      Reference design

      PMP40690 — 4-kW interleaved CCM totem pole bridgeless PFC reference design using C2000™ MCU and GaN

      This reference design is a 4-kW interleaved CCM totem pole (TTPL) bridgeless PFC reference design using a 64-pin C2000™ microcontroller, LM3410 gallium nitride device and TMCS1100 hall sensor. It is based on TIDM-02008 bidirectional interleaved CCM TTPL bridgeless PFC reference (...)
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      Package Pins CAD symbols, footprints & 3D models
      VQFN (RWH) 32 Ultra Librarian

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