Driver or library
HCS-SMARTFUSE-DRIVERS — Simple C drivers and code examples for HCS smart fuse devices
Simple C drivers and code examples for HCS smart fuse devices
TPS2HCS10-Q1
Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI
Data sheet
TPS2HCS10-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Withstands 35-V load dump
- Functional Safety-Compliant Development
- Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
- Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
- Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
- Protection against persistent overload condition
- Improve system level reliability through SPI programmable adjustable overcurrent protection
- Overcurrent protection threshold: 10 to 70 A
- SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
- Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short-to-ground
- Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Digital sense output via SPI can be configured to measure:
- Load current accurately with integrated ADC
- Output or supply voltage, FET temperature
- Provides full fault diagnostics through SPI interface and indication through FLT pin
- Detection of open load and short-to-battery
The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.
The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.
The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.
The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
Technical documentation
No results found. Please clear your search and try again.
View all 11 Design & development
For additional terms or required resources, click any title below to view the detail page where available.
Evaluation board
HSS-2HCS10EVM — TPS2HCS10-Q1 daughter card for smart fuse high-side switch
The HSS-2HCS10EVM is a daughter card designed to be used with the HSS-HCMOTHERBRDEVM. This daughter card shows the functionality of Texas Instruments' smart fuse portfolio.
Evaluation board
HSS-HCMOTHERBRDEVM — Smart fuse evaluation module
The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a (...)
Evaluation board
HSS-HCS-BLANKEVM — Unpopulated evaluation module for smart fuse switch portfolio
The HSS-HCS-BLANKEVM is a daughtercard designed to be used with the HSS-HCMOTHERBRDEVM. This daughtercard shows the functionality of our smart fuse portfolio.
GUI for evaluation module (EVM)
HSS-HCSRCPACKAGE — Source package for GUI and firmware of HSS-HCMOTHERBRDEVM
Contains the C++ source code for the Smart Fuse Configurator GUI as well as the firmware source code for the TM4C microcontroller running on the HSS-HCMOTHERBRDEVM module.
Supported products & hardware
Products
High-side switches
Hardware development
Evaluation board
GUI for evaluation module (EVM)
HSS-SMART-CONFIGURATOR — Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches
This software allows the user to configure and monitor diagnostics for the HSS-HCMOTHERBRDEVM high-side switch evaluation module. Device settings, diagnostics, and configuration can be read, changed, and manipulated via this software.
Supported products & hardware
Products
High-side switches
Hardware development
Evaluation board
Support software
HCS-HEADER-FILES — C Header files for smart fuse high-side switches with register definitions
C header files for smart-fuse high-side switches with register definitions
Supported products & hardware
Products
High-side switches
Hardware development
Evaluation board
Simulation tool
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| HTSSOP (PWP) | 16 | Ultra Librarian |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Information included:
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.