The TPSI2260-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2260-Q1 uses TI’s high reliability reinforced capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply. The TPSI2260-Q1 improves system reliability as TI’s capacitive isolation technology does not suffer from mechanical wearout or photo degradation failure modes common in mechanical relay and photo relay components.
The primary side of the device is powered by only 5mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device should be connected to a system supply between 4.5V to 20V and the EN pin of the device should be driven by a GPIO output with Logic high between 2.1V to 20V. In other applications, the VDD and EN pins could be driven together driven together directly from the system supply or from a GPIO output.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±600V from S1 to S2. The TPSI2260-Q1 MOSFET avalanche robustness and thermally conscious package design allow it to robustly support system level dielectric withstand testing (HiPot) and DC fast charger surge currents of up to 1mA (3mA for TPSI2260T-Q1)without requiring any external components.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TPSI2260-Q1 600V, 50mA, Automotive Reinforced Solid-State Relay With Avalanche Protection datasheet (Rev. A) | PDF | HTML | 03 Dec 2025 |
| Functional safety information | TPSI2260-Q1 Functional Safety FIT Rate, FMD and Pin FMA (Rev. A) | PDF | HTML | 05 Dec 2025 | |
| Certificate | TPSI2260Q1EVM EU Declaration of Conformity (DoC) | 24 Jan 2025 |
For additional terms or required resources, click any title below to view the detail page where available.
The TPSI2260Q1EVM is a hardware evaluation module (EVM) containing multiple test points and jumpers to fully evaluate the performance and functionality of the device. The evaluation module contains everything needed to test and assess the TPSI2260-Q1 before designing into part of the power system (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOIC (DWQ) | 11 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.