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TPSM82864A

ACTIVE

2.4-V to 5.5-V Input, 4-A thin step-down power module with integrated inductor in 3.5-mm x 4-mm QFN

Product details

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 2.5 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 5.5 Switching frequency (min) (kHz) 2200 Switching frequency (max) (kHz) 2500 Features EMI Tested, Enable, Light Load Efficiency, Output discharge, Overcurrent protection, Power good Control mode DCS-Control Duty cycle (max) (%) 100
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 2.5 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 5.5 Switching frequency (min) (kHz) 2200 Switching frequency (max) (kHz) 2500 Features EMI Tested, Enable, Light Load Efficiency, Output discharge, Overcurrent protection, Power good Control mode DCS-Control Duty cycle (max) (%) 100
B0QFN (RDJ) 23 14 mm² 3.5 x 4 B0QFN (RDM) 23 14 mm² 3.5 x 4
  • Up to 96% efficiency
  • Excellent thermal performance
  • 1% output voltage accuracy
  • DCS-Control topology for fast transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Simplified layout through optimized pinout
  • 2.4V to 5.5V input voltage range
  • Same device part number provides:
    • 0.6V to VIN adjustable output voltage
    • 13 integrated fixed output voltage options
    • Forced PWM or power save mode
  • Power-good indicator with window comparator
  • 2.4MHz switching frequency
  • 4µA operating quiescent current
  • Output voltage discharge
  • 100% duty cycle mode
  • –40°C to 125°C operating temperature range
  • QFN package with 0.5mm pitch:
    • RDJ, RDM: 3.5mm × 4.0mm
    • RCF (MagPack): 2.3mm × 3.0mm
  • Small design size:
    • RDJ, RDM: 35mm2 design size
    • RCF (MagPack): 28mm2 design size
  • Also available with I2C interface: TPSM82866C
  • Up to 96% efficiency
  • Excellent thermal performance
  • 1% output voltage accuracy
  • DCS-Control topology for fast transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Simplified layout through optimized pinout
  • 2.4V to 5.5V input voltage range
  • Same device part number provides:
    • 0.6V to VIN adjustable output voltage
    • 13 integrated fixed output voltage options
    • Forced PWM or power save mode
  • Power-good indicator with window comparator
  • 2.4MHz switching frequency
  • 4µA operating quiescent current
  • Output voltage discharge
  • 100% duty cycle mode
  • –40°C to 125°C operating temperature range
  • QFN package with 0.5mm pitch:
    • RDJ, RDM: 3.5mm × 4.0mm
    • RCF (MagPack): 2.3mm × 3.0mm
  • Small design size:
    • RDJ, RDM: 35mm2 design size
    • RCF (MagPack): 28mm2 design size
  • Also available with I2C interface: TPSM82866C

The TPSM8286xA device family consists of 4A and 6A step-down converter power modules designed for small solution size and high efficiency. The power modules integrate a synchronous step-down converter and an inductor to simplify design, reduce external components, and save PCB area. The low-profile and compact solution is designed for automated assembly by standard surface mount equipment. Tight output voltage accuracy, even with small output capacitors, is achieved though the DCS-Control architecture and the excellent load transient performance. At medium-to-heavy loads, the converter operates in PWM mode and automatically enters power save mode operation at light load to maintain high efficiency over the entire load current range. The devices can also be forced in PWM mode operation for the smallest output voltage ripple. The EN and PG pins, which support sequencing configurations, bring a flexible system design. An integrated soft start reduces the inrush current required from the input supply. The RDJ package supports thin designs with 1.4mm height.

The TPSM8286xA device family consists of 4A and 6A step-down converter power modules designed for small solution size and high efficiency. The power modules integrate a synchronous step-down converter and an inductor to simplify design, reduce external components, and save PCB area. The low-profile and compact solution is designed for automated assembly by standard surface mount equipment. Tight output voltage accuracy, even with small output capacitors, is achieved though the DCS-Control architecture and the excellent load transient performance. At medium-to-heavy loads, the converter operates in PWM mode and automatically enters power save mode operation at light load to maintain high efficiency over the entire load current range. The devices can also be forced in PWM mode operation for the smallest output voltage ripple. The EN and PG pins, which support sequencing configurations, bring a flexible system design. An integrated soft start reduces the inrush current required from the input supply. The RDJ package supports thin designs with 1.4mm height.

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Technical documentation

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Type Title Date
* Data sheet TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack Package datasheet (Rev. D) PDF | HTML 06 Nov 2024
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 Dec 2023
EVM User's guide TPSM8286xAA0xEVM User's Guide (Rev. A) PDF | HTML 21 Nov 2022
Application note Intro to Multi-Function Pins and Their Applications in TI Step-Down Converters (Rev. A) PDF | HTML 17 Nov 2022
Application note Quick Reference Guide To TI Buck Switching DC/DC Application Notes (Rev. B) PDF | HTML 23 May 2022
Application note Understanding SOA Curves to Operate at High Output Currents and Temperature PDF | HTML 05 May 2022
Functional safety information TPSM82866A and TPSM82864A Pin Failure Mode Analysis (Pin FMA) PDF | HTML 03 Mar 2022
White paper Enabling Higher Data Rates for Optical Modules With Small and Efficient Power 22 Mar 2021
White paper Benefits of a Resistor-to-Digital Converter in Ultra-Low Power Supplies 14 Oct 2019
Analog Design Journal Methods of output-voltage adjustment for DC/DC converters 14 Jun 2019
Application note Performing Accurate PFM Mode Efficiency Measurements (Rev. A) 11 Dec 2018
Analog Design Journal Understanding 100% mode in low-power DC/DC converters 22 Jun 2018
Analog Design Journal Achieving a clean startup by using a DC/DC converter with a precise enable-pin threshold 24 Oct 2017
Analog Design Journal Improving the thermal performance of a MicroSiP(TM) power module 24 Jul 2017
Analog Design Journal Testing tips for applying external power to supply outputs without an input voltage 24 Oct 2016
Analog Design Journal Adjusting the soft-start time of an integrated power module 26 Apr 2016
Analog Design Journal Understanding frequency variation in the DCS-Control(TM) topology 30 Oct 2015
Analog Design Journal Five steps to a great PCB layout for a step-down converter 29 Jan 2015
Analog Design Journal Accurately measuring efficiency of ultralow-IQ devices 22 Jan 2014
Analog Design Journal High-efficiency, low-ripple DCS-Control offers seamless PWM/pwr-save transitions 25 Jul 2013
Analog Design Journal Design considerations for a resistive feedback divider in a DC/DC converter 26 Apr 2012
Application note Choosing an Appropriate Pull-up/Pull-down Resistor for Open Drain Outputs 19 Sep 2011
Analog Design Journal IQ: What it is, what it isn’t, and how to use it 17 Jun 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPSM82864AA0HEVM — TPSM82864A 4-A, 3.5-mm x 4-mm x 1.8-mm power module with integrated inductor evaluation module

The TPSM82864AA evaluation module (EVM) facilitates the evaluation of the TPSM82864A, a 4 A pin-to-pin compatible step-down power module with DCS-Control in a 3.5 mm × 4 mm x 1.8 mm overmolded QFN package. The EVM provides a 1.2 V output voltage with 1% accuracy for input voltages from 2.4 V to (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM82864AA0SEVM — TPSM82864A evaluation module 4-A, 3.5-mm x 4-mm x 1.4-mm power module with integrated inductor

The TPSM82864AA0SEVM evaluation module (EVM) facilitates the evaluation of the TPSM82864A, a 4-A pin-to-pin compatible step-down power module with DCS-Control in a 3.5-mm × 4-mm x 1.4-mm overmolded QFN package. The EVM provides a 1.2-V output voltage with 1% accuracy for input voltages from (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM82866AA0HEVM — TPSM82866A 6-A, 3.5-mm x 4-mm x 1.8-mm power module with integrated inductor evaluation module

The TPSM82866A evaluation module (EVM) facilitates the evaluation of the TPSM82866A, a 6 A pin-to-pin compatible step-down power module with DCS-Control in a 3.5 mm × 4 mm x 1.8 mm overmolded QFN package. The EVM provides a 1.2 V output voltage with 1% accuracy for input voltages from 2.4 V to 5.5 (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM82866AA0SEVM — TPSM82866A evaluation module 6-A, 3.5-mm x 4-mm x 1.4-mm power module with integrated inductor

The TPSM82866AA0SEVM evaluation module (EVM) facilitates the evaluation of the TPSM82866A, a 6-A pin-to-pin compatible step-down power module with DCS-Control in a 3.5-mm × 4-mm x 1.4-mm overmolded QFN package. The EVM provides a 1.2-V output voltage with 1% accuracy for input voltages from (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

TPSM82864AA0HRDMR PSpice Unencrypted Transient Model

SLUM892.ZIP (191 KB) - PSpice Model
Simulation model

TPSM82864AA0SRDJR PSpice Unencrypted Transient Model

SLUM891.ZIP (176 KB) - PSpice Model
Gerber file

BSR182A Gerber

SLVC828.ZIP (432 KB)
Gerber file

SR054A Gerber File

SLVC857.ZIP (2091 KB)
Package Pins CAD symbols, footprints & 3D models
B0QFN (RDJ) 23 Ultra Librarian
B0QFN (RDM) 23 Ultra Librarian

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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