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LP8553

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适用于笔记本电脑的四通道高效 LED 背光驱动器，具有 3.3V PWM 逻辑电平

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LP8553

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产品详情

Number of channels 4 Vin (min) (V) 2.7 Vin (max) (V) 22 Vout (min) (V) 10 Vout (max) (V) 40 Type Inductive Switching frequency (max) (kHz) 1250 Duty cycle (max) (%) 100 LED current per channel (mA) 50 Peak efficiency (%) 93 Topology Boost Features PWM control Operating temperature range (°C) -30 to 85 Rating Catalog
Number of channels 4 Vin (min) (V) 2.7 Vin (max) (V) 22 Vout (min) (V) 10 Vout (max) (V) 40 Type Inductive Switching frequency (max) (kHz) 1250 Duty cycle (max) (%) 100 LED current per channel (mA) 50 Peak efficiency (%) 93 Topology Boost Features PWM control Operating temperature range (°C) -30 to 85 Rating Catalog
DSBGA (YZR) 25 7.5625 mm² 2.75 x 2.75
  • High-Voltage DC/DC Boost Converter with Integrated FET
    with Four Switching Frequency Options: 156/312/625/1250 kHz
  • 2.7V to 22V Input Voltage Range to Support 1x…5x Cell
    Li-Ion Batteries
  • Programmable PWM Resolution
    • 8 to 13 True Bit (Steady State)
    • Additional 1 to 3 Bits Using Dithering During Brightness
      Changes
  • I2C and PWM Brightness Control
  • Automatic PWM & Current Dimming for Improved
    Efficiency
  • PWM Output Frequency and LED Current Set Through
    Resistors
  • Optional Synchronization to Display VSYNC
    Signal
  • 4 LED Outputs with LED Fault (Short/Open) Detection
  • Low Input Voltage, Over-Temperature, Over-Current Detection
    and Shutdown
  • Minimum Number of External Components
  • DSBGA 25-Bump Package, 2.466 × 2.466 × 0.6 mm
  • High-Voltage DC/DC Boost Converter with Integrated FET
    with Four Switching Frequency Options: 156/312/625/1250 kHz
  • 2.7V to 22V Input Voltage Range to Support 1x…5x Cell
    Li-Ion Batteries
  • Programmable PWM Resolution
    • 8 to 13 True Bit (Steady State)
    • Additional 1 to 3 Bits Using Dithering During Brightness
      Changes
  • I2C and PWM Brightness Control
  • Automatic PWM & Current Dimming for Improved
    Efficiency
  • PWM Output Frequency and LED Current Set Through
    Resistors
  • Optional Synchronization to Display VSYNC
    Signal
  • 4 LED Outputs with LED Fault (Short/Open) Detection
  • Low Input Voltage, Over-Temperature, Over-Current Detection
    and Shutdown
  • Minimum Number of External Components
  • DSBGA 25-Bump Package, 2.466 × 2.466 × 0.6 mm

The LP8553 is a white LED driver with integrated boost converter. It has four adjustable current sinks which can be controlled by PWM input or with I2C-compatible serial interface.

The boost converter has adaptive output-voltage control based on the LED driver voltages. This feature minimizes the power consumption by adjusting the voltage to lowest sufficient level in all conditions.

LED outputs have 8-bit current resolution and up to 13-bit PWM resolution with additional 1-3 bit dithering to achieve smooth and precise brightness control. Proprietary Phase Shift PWM control is used for LED outputs to reduce peak current from the boost converter, thus making the boost capacitors smaller. The Phase Shifting scheme also eliminates audible noise.

Automatic PWM dimming at lower brightness values and current dimming at higher brightness values can be used to improve the optical efficiency.

Internal EEPROM is used for storing the configuration data. This makes it possible to have minimum external component count and make the solution very small.

LP8553 has safety features which make it possible to detect LED outputs with open or short fault. Low input voltage and boost over-current conditions are also monitored, and the chip is turned off when these events occur. Thermal de-rating function prevents overheating of the device by reducing backlight brightness when set temperature has been reached.

LP8553 is available in TI’s DSBGA 25-bump package.

The LP8553 is a white LED driver with integrated boost converter. It has four adjustable current sinks which can be controlled by PWM input or with I2C-compatible serial interface.

The boost converter has adaptive output-voltage control based on the LED driver voltages. This feature minimizes the power consumption by adjusting the voltage to lowest sufficient level in all conditions.

LED outputs have 8-bit current resolution and up to 13-bit PWM resolution with additional 1-3 bit dithering to achieve smooth and precise brightness control. Proprietary Phase Shift PWM control is used for LED outputs to reduce peak current from the boost converter, thus making the boost capacitors smaller. The Phase Shifting scheme also eliminates audible noise.

Automatic PWM dimming at lower brightness values and current dimming at higher brightness values can be used to improve the optical efficiency.

Internal EEPROM is used for storing the configuration data. This makes it possible to have minimum external component count and make the solution very small.

LP8553 has safety features which make it possible to detect LED outputs with open or short fault. Low input voltage and boost over-current conditions are also monitored, and the chip is turned off when these events occur. Thermal de-rating function prevents overheating of the device by reducing backlight brightness when set temperature has been reached.

LP8553 is available in TI’s DSBGA 25-bump package.
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类型 标题 下载最新的英语版本 日期
* 数据表 LP8553 High-Efficiency LED Backlight Driver for Notebooks 数据表 (Rev. B) 2014年 1月 3日
白皮书 常见 LED 功能和 LED 驱动器设计注意事项 英语版 2020年 9月 21日
应用手册 Some Guidelines and Tips for the LED Driver Application 2019年 8月 14日
选择指南 电源管理指南 2018 (Rev. K) 2018年 7月 31日
选择指南 电源管理指南 2018 (Rev. R) 2018年 6月 25日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

驱动程序或库

LP8550SW-LINUX — 适用于 LP8550 的 Linux 驱动程序

The Linux driver supports the LP8550/1/2/3/5/6 and LP8557. The Linux driver supports communication through the I2C bus and interfaces with the backlight and PWM sub-system.

 

Linux Mainline Status

Available in Linux Main line: Yes
Available through git.ti.com: N/A

Supported Devices:

  • lp8550
  • lp8551
  • lp8552
  • (...)
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模拟工具

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封装 引脚 CAD 符号、封装和 3D 模型
DSBGA (YZR) 25 Ultra Librarian
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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