可提供此产品的更新版本
功能与比较器件相同,且具有相同引脚
UC1825-SP
- QML-V Qualified, SMD 5962-87681
- Rad-Tolerant: 30 kRad (Si) TID(1)
- Compatible With Voltage- or Current-Mode Topologies
- Practical Operation Switching Frequencies to 1 MHz
- 50-ns Propagation Delay-to-Output
- High-Current Dual Totem Pole Outputs (1.5 A Peak)
- Wide Bandwidth Error Amplifier
- Fully Latched Logic With Double-Pulse Suppression
- Pulse-by-Pulse Current Limiting
- Soft Start/Maximum Duty-Cycle Control
- Undervoltage Lockout With Hysteresis
- Low Start-Up Current (1.1 mA)
(1) Radiation tolerance is a typical value based upon initial device qualification with dose rate = 10 mrad/sec. Radiation Lot Acceptance Testing is available - contact factory for details.
The UC1825 PWM control device is optimized for high-frequency switched mode power supply applications. Particular care was given to minimizing propagation delays through the comparators and logic circuitry while maximizing bandwidth and slew rate of the error amplifier. This controller is designed for use in either current-mode or voltage mode systems with the capability for input voltage feed-forward.
Protection circuitry includes a current limit comparator with a 1-V threshold, a TTL compatible shutdown port, and a soft start pin which will double as a maximum duty-cycle clamp. The logic is fully latched to provide jitter-free operation and prohibit multiple pulses at an output. An undervoltage lockout section with 800 mV of hysteresis assures low start up current. During undervoltage lockout, the outputs are high impedance.
This device features totem pole outputs designed to source and sink high peak currents from capacitive loads, such as the gate of a power MOSFET. The on state is designed as a high level.
您可能感兴趣的相似产品
功能与比较器件相似
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | High-Speed PWM Controller. 数据表 (Rev. A) | 2012年 3月 22日 | |||
* | SMD | UC1825-SP SMD 5962-87681 | 2016年 7月 8日 | |||
* | 辐射与可靠性报告 | UC1825-SP Radiation Test Report (5962-8768104VEA) | 2015年 5月 8日 | |||
选择指南 | TI Space Products (Rev. J) | 2024年 2月 12日 | ||||
更多文献资料 | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 2023年 8月 31日 | ||||
应用手册 | QML flow, its importance, and obtaining lot information (Rev. C) | 2023年 8月 30日 | ||||
应用手册 | 单粒子效应置信区间计算 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2022年 12月 2日 | |
应用手册 | 重离子轨道环境单粒子效应估算 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2022年 11月 30日 | |
电子书 | 电子产品辐射手册 (Rev. B) | 2022年 5月 7日 | ||||
应用简报 | Controlling Input Power for Present and Next-Generation Power Controllers | PDF | HTML | 2020年 12月 14日 | |||
应用手册 | DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers Primer | 2020年 8月 21日 | ||||
应用手册 | Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form | PDF | HTML | 2020年 5月 18日 | |||
电子书 | 电子产品辐射手册 (Rev. A) | 2019年 5月 21日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点