产品详情

Local sensor accuracy (max) 1.25 Type Local Operating temperature range (°C) -55 to 150 Supply voltage (min) (V) 2.65, 3 Interface type SPI Supply voltage (max) (V) 5.5 Supply current (max) (µA) 470 Temp resolution (max) (bps) 13 Remote channels (#) 0 Rating Catalog
Local sensor accuracy (max) 1.25 Type Local Operating temperature range (°C) -55 to 150 Supply voltage (min) (V) 2.65, 3 Interface type SPI Supply voltage (max) (V) 5.5 Supply current (max) (µA) 470 Temp resolution (max) (bps) 13 Remote channels (#) 0 Rating Catalog
DSBGA (YTA) 5 3.0625 mm² 1.75 x 1.75 SOIC (D) 8 29.4 mm² 4.9 x 6
  • 0.0625°C Temperature Resolution
  • Shutdown Mode Conserves Power Between Temperature Reading
  • SPI and MICROWIRE Bus Interface
  • 5-Bump DSBGA Package Saves Space

Key Specifications

  • Supply Voltage 3.0V or 2.65V to 5.5V
  • Supply Current
    • Operating265μA (typ)520μA (max)
    • Shutdown3μA (typ)
  • Temperature Accuracy
    • −10°C to 65°C, ±1.25°C(max)
    • −25°C to 110°C, ±2.1°C(max)
    • −55°C to 125°C, ±3°C(max)

All trademarks are the property of their respective owners.

  • 0.0625°C Temperature Resolution
  • Shutdown Mode Conserves Power Between Temperature Reading
  • SPI and MICROWIRE Bus Interface
  • 5-Bump DSBGA Package Saves Space

Key Specifications

  • Supply Voltage 3.0V or 2.65V to 5.5V
  • Supply Current
    • Operating265μA (typ)520μA (max)
    • Shutdown3μA (typ)
  • Temperature Accuracy
    • −10°C to 65°C, ±1.25°C(max)
    • −25°C to 110°C, ±2.1°C(max)
    • −55°C to 125°C, ±3°C(max)

All trademarks are the property of their respective owners.

The LM74 is a temperature sensor, Delta-Sigma analog-to-digital converter with an SPI and MICROWIRE compatible interface. The host can query the LM74 at any time to read temperature. A shutdown mode decreases power consumption to less than 10 μA. This mode is useful in systems where low average power consumption is critical.

The LM74 has 12-bit plus sign temperature resolution (0.0625°C per LSB) while operating over a temperature range of −55°C to +150°C.

The LM74's 3.0V to 5.5V supply voltage range, low supply current and simple SPI interface make it ideal for a wide range of applications. These include thermal management and protection applications in hard disk drives, printers, electronic test equipment, and office electronics. The LM74 is available in the SOIC package as well as the 5-Bump DSBGA package.

The LM74 is a temperature sensor, Delta-Sigma analog-to-digital converter with an SPI and MICROWIRE compatible interface. The host can query the LM74 at any time to read temperature. A shutdown mode decreases power consumption to less than 10 μA. This mode is useful in systems where low average power consumption is critical.

The LM74 has 12-bit plus sign temperature resolution (0.0625°C per LSB) while operating over a temperature range of −55°C to +150°C.

The LM74's 3.0V to 5.5V supply voltage range, low supply current and simple SPI interface make it ideal for a wide range of applications. These include thermal management and protection applications in hard disk drives, printers, electronic test equipment, and office electronics. The LM74 is available in the SOIC package as well as the 5-Bump DSBGA package.

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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 LM74 SPI/ MICROWIRE 12-Bit Plus Sign Temperature Sensor 数据表 (Rev. K) 2013年 3月 22日
应用手册 AN-1256 Tiny Temperature Sensors for Portable Systems (Rev. A) 2013年 4月 26日
应用手册 Tiny Temperature Sensors for Remote Systems 2003年 2月 17日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

驱动程序或库

LM70SW-LINUX — 用于 LM70 的 Linux 驱动程序

Linux 驱动程序支持 LM70 系列温度传感器。Linux 驱动程序支持通过 SPI 总线和接口与硬件监测子系统进行通信。
Linux 主线状态

在 Linux 主线中提供:是
可通过 git.ti.com 获取:不适用

支持的器件:
  • lm70
  • tmp121
  • lm71
  • lm74
Linux 源文件

与该器件关联的文件为:

  1. drivers/hwmon/lm70.c
  2. Documentation/hwmon/lm70
源文件

drivers/hwmon/lm70.c

其他文件

Documentation/hwmon/lm70

 

启用驱动程序支持

使用“make (...)
封装 引脚 CAD 符号、封装和 3D 模型
DSBGA (YTA) 5 Ultra Librarian
SOIC (D) 8 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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