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CSD23280F3

ACTIVE

-12-V, P channel NexFET™ power MOSFET, single LGA 0.6 mm x 0.7 mm, 116 mOhm, gate ESD protection

Product details

VDS (V) -12 VGS (V) -6 Type P-channel Configuration Single Rds(on) at VGS=4.5 V (max) (mΩ) 116 Rds(on) at VGS=2.5 V (max) (mΩ) 165 VGSTH typ (typ) (V) -0.65 QG (typ) (nC) 0.95 QGD (typ) (nC) 0.068 QGS (typ) (nC) 0.3 ID - silicon limited at TC=25°C (A) 1.8 Logic level Yes Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) -12 VGS (V) -6 Type P-channel Configuration Single Rds(on) at VGS=4.5 V (max) (mΩ) 116 Rds(on) at VGS=2.5 V (max) (mΩ) 165 VGSTH typ (typ) (V) -0.65 QG (typ) (nC) 0.95 QGD (typ) (nC) 0.068 QGS (typ) (nC) 0.3 ID - silicon limited at TC=25°C (A) 1.8 Logic level Yes Rating Catalog Operating temperature range (°C) -55 to 150
PICOSTAR (YJM) 3 0.414 mm² 0.69 x 0.6
  • Low On-Resistance
  • Ultra-Low Qg and Qgd
  • High-operating drain current
  • Ultra-small footprint
    • 0.73 mm × 0.64 mm
  • Ultra-low profile
    • 0.36-mm max height
  • Integrated ESD protection diode
    • Rated > 4-kV HBM
    • Rated > 2-kV CDM
  • Lead and halogen free
  • RoHS compliant
  • Low On-Resistance
  • Ultra-Low Qg and Qgd
  • High-operating drain current
  • Ultra-small footprint
    • 0.73 mm × 0.64 mm
  • Ultra-low profile
    • 0.36-mm max height
  • Integrated ESD protection diode
    • Rated > 4-kV HBM
    • Rated > 2-kV CDM
  • Lead and halogen free
  • RoHS compliant

This –12-V, 97-mΩ, P-Channel FemtoFET™ MOSFET is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing a substantial reduction in footprint size.

This –12-V, 97-mΩ, P-Channel FemtoFET™ MOSFET is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing a substantial reduction in footprint size.

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CSD25480F3 ACTIVE -20-V, P channel NexFET™ power MOSFET, single LGA 0.6 mm x 0.7 mm, 159 mOhm, gate ESD protection Alternate 12 V versus 20 V, lower resistance

Technical documentation

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Top documentation Type Title Format options Date
* Data sheet CSD23280F3 –12-V P-Channel FemtoFET MOSFET datasheet (Rev. B) PDF | HTML 08 Sep 2021
Application brief Estimating Leakage Currents of Power MOSFETs PDF | HTML 31 Oct 2025
Application note MOSFET Support and Training Tools (Rev. G) PDF | HTML 27 Oct 2025
Application note Semiconductor and IC Package Thermal Metrics (Rev. D) PDF | HTML 25 Mar 2024
Application note Using MOSFET Transient Thermal Impedance Curves In Your Design PDF | HTML 18 Dec 2023
Application note Solving Assembly Issues with Chip Scale Power MOSFETs PDF | HTML 14 Dec 2023
Application note Using MOSFET Safe Operating Area Curves in Your Design PDF | HTML 13 Mar 2023
Application brief Tips for Successfully Paralleling Power MOSFETs PDF | HTML 31 May 2022
More literature WCSP Handling Guide 07 Nov 2019
Design guide FemtoFET Surface Mount Guide (Rev. D) 07 Jul 2016
Technical article FemtoFET MOSFETs: small as sand but it’s all about that pitch PDF | HTML 27 Jun 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

CSD1FPCHEVM-890 — FemtoFET P-ch Evaluation Module

This FemtoFET P-ch EVM includes six daughter cards, each card containing a different FemtoFET p-ch part number.  The daughter cards allow the engineer to easily connect and test these tiny devices.  The six FemtoFETs range from 12V to 20V Vds, and the size of the devices include F3 (...)

User guide: PDF
Not available on TI.com
Support software

LOAD-SWITCH-FET-LOSS-CALC Power Loss Calculation Tool for Load Switch

Quickly trade off size, cost and performance to select the optimal MOSFET based on application conditions.
Supported products & hardware

Supported products & hardware

Simulation model

CSD23280F3 Unencrypted PSpice Model (Rev. A)

SLPM175A.ZIP (3 KB) - PSpice Model
Reference designs

TIDA-01589 — High fidelity, near-field two-way audio reference design with noise reduction and echo cancellation

Man machine interaction requires an acoustic interface for providing full duplex hands-free communication. In hands-free mode, part of the far-end or near-end audio signal from the speaker is coupled to the microphones. Furthermore, in noisy environments the microphones also capture ambient noise (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01228 — Low-Power Water Flow Measurement With Inductive Sensing Reference Design

This reference design demonstrates a highly-integrated solution for this application using an inductive sensing technique enabled by the CC1350 SimpleLink™ Wireless MCU and FemtoFET™ MOSFET. This reference design also provides the platform for integration of wireless communications (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
PICOSTAR (YJM) 3 Ultra Librarian

Ordering & quality

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  • REACH
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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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